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Production

SMD-Assembly:

Equipped with chip-shooter and pick-and-place for low and medium volume with the capacity of 250 Mil. assemblies a year from 2001 bis 200 x 125 mm2.

SPI and AOI-system, dust-free depanelization and in-circuit- & functional-test-equipment is in use for 100% of all products.

Other processes like laser-engraving, fully automatic varnishing and a variation of gluing-processes are installed.

Local partners for test equipment and production-equipment.

The plastic injection, mould-design and mould-making are the core-competence of the members of the BurgerGruppe Schonach, Germany.

Assembly:

Our core business is the assembly of electronic and electro-mechanic products with manual work, up to semi-automatic processes in high volume of >70,000 units a day,

including packing, hand-soldering, glueing, potting, screwing, varnishing, labeling, etc.

Wire-Dressing:

We provide cable-harnesses in small and medium quantities with wire-cutting/stripping, automatic bandage and various crimping processes, including 100% crimp-force-control.

All processes are according RoHS.

Leaded soldering possible on demand.

SBS-Nepron © 1999-2023